Hangzhou Liansheng Insulation Co., Ltd

Detailed introduction to Lapping/Polishing Carrier:

There are more and more precision parts need to lapping and polishing. Our company is concentrated to developing the carriers to the industry by our own equipment and instruments.

Lapping carriers ,also called workholders). If you have a drawing or sample part for a lapping carrier from 2" to 40" outside diameter, we can probably make these for you.

To make high quality semiconductor, the wafer cut from silicone ingot needs to have same thickness, the flatness, and to be paralleled. This process is called “Lapping Process. This insert lapping carrier yields lower chips, cracks, scratches on Silicone wafers and high flatness Silicone wafers.

Lapping carriers are available in a wide variety of materials and thicknesses. 

We  uses a wide variety of state of the art manufacturing methods to create your lapping carriers including, precision punching, hobbing, CNC machining, CNC routing, and Laser cutting. With these options, nearly any lapping carrier configuration is available. We will recommend the most cost effective method based on your machine and volume requirements.

We can provide you with a newly type of unique DSP carriers. There are insert parts in the holes in between FR-4 and objects and it prevents chips, cracks and scratches on the objects and yields high flatness Objects.

 Application

It is widly used in the semiconductor industry (and other high value wafer industries) to protect the edge profile of the wafer while providing the strength and durability of a traditional steel carrier.